Publication   Inductive Contamination Analysis (ICA) with SRAM Application Abstract -- This paper proposes a new simulation-base fault modeling methodology. The methodology -an extensin of Inductive Fault Analysis -uses the contamination-defect-fault simulator CODEF to directly relate effects of process-induced contamination to circuit-level malfunctions. The application of this methodology (called Inductive Contamination Analysis) is demonstrated by development of SRAM fault models. J. Khare and W. Maly, "Inductive Contamination Analysis (ICA) with SRAM Application", IEEE International Test Conference, October 1995, Washington D.C., pp. 552-560.   Contamination-Defect-Fault-Simulation for 0.5 micron CMOS Technology T. Zanon, "Contamination-Defect-Fault-Simulation for 0.5 micron CMOS Technology", Masters Thesis, University of Munich, Munich, Germany, 1996. Get the thesis.   Improved Usability of Contamination-Defect-Fault Simulation Abstract -- Relationship between defects and faults can be extracted from simulating the wafer process with contamination. However, the run-time of accurate process simulation has been unsatisfiable. In addition, the analysis of the simulation result can be over-whelmingly laborious. This thesis introduces a method to dramatically reduce the run-time of the simulator without sacrificing any accuracy and a tool to faciliate the anlysis of simulation results. J.T. Chen, "Improved Usability of Contamination-Defect-Fault Simulation", Masters Thesis, Carnegie Mellon University, Pittsburgh, PA, 1998. Get the thesis.

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