Notes on:
Automotive Electronics Reliability SP-696, SAE (Marvin Hartz, Organizer), Warrendale PA, 1987. (67 pages).
This is a collection of SAE papers that together form a design manual for automotive reliability. In particular it addresses the differences between automotive applications and defense/aerospace approaches such as MIL-HDBK-217. Topics include reliability prediction for electrical components, electronics, wiring harnesses, and mechanical components.
The various papers can also be obtained from SAE Transactions, 1987, Vol. 86, Section 1, which may be more likely to be in libraries than this particular publication.
Topic coverage: (*** = emphasized; ** = discussed with some detail; * = mention)
*** | Dependability | *** | Electronic Hardware | Requirements | |||||
Safety | Software | *** | Design | ||||||
Security | ** | Electro-Mechanical Hardware | ** | Manufacturing | |||||
Scalability | Control Algorithms | ** | Deployment | ||||||
Latency | Humans | * | Logistics | ||||||
** | Affordability | Society/Institutions | Retirement |
Other topics: automotive-specific issues.
Preface:
"The implementation of on board electronics has enabled the automotive industry to make dramatic improvements in function, cost, weight reduction, and reliability of present day vehicles. Electronic controls have been applied to virtually all vehicle functions. This rapid escalation in the number of automotive electronic systems requires a need for methods and effective procedures to control and predict the reliability of electronic systems.
"In 1978 an Electronic Reliability Subcommittee was formed within the structure of the SAE Electronic Systems Committee. This committee recognized the limited usefulness of the industry standard component reliability prediction methodology of MIL-HDBK-217 for application to the environmental exposure and service requirements of the modern automobile. In 1983 the Electronic Reliability Subcommittee authored SAE paper 840486 which provides a predictive model for automotive components and systems based on failure rate information of automotive components. This year, 1987, SAE, with the support of the Electronic Reliability Subcommittee, is publishing'a comprehensive design manual which presents the methodology procedures and technical references needed by designers to make capable electronic system reliability predictions.
"The eight papers presented in this session augment the preceding work of the Reliability Subcommittee. The topics of discussion include update information on previously developed prediction models, case studies of given system prediction, analysis of the efficacity of prediction methodology, economic issues related to reliability prediction, and discussions of applicability of electronics reliability prediction methodology to other vehicle systems, i.e., in this case, automotive electrical wire networks. "
Marvin E. Hartz
870050 Automotive Electronic Reliability Prediction 1 William K. Denson and Mary G. Priore IIT Research Institute 870051 Reliability Prediction Techniques-Electrical/Electronic Products 13 William Kerscher Product Assurance AC Spark Plug Div. General Motors Corp. 870052 Reliability Analysis of Mechanical Components 21 James A. Davis and Sandeep Johri Product Assurance AC Spark Plug Div. General Motors Corp. 870053 Defining the Uncertainty of Reliability Predictions 29 E. Harold Vannoy Product Assurance AC Spark Plug Div. General Motors Corp. Tony Lin Industrial Systems Engineering GMI Engineering & Management Institute 870054 Confidence Allocation in System Reliability Estimation 37 E. Harold Vannoy and Hal Stephenson Product Assurance AC Spark Plug Div. General Motors Corp. 870055 Prediction of Wiring Harness Reliability 45 J. H. Derr Research Staff Ford Motor Co. C. M. Straub and S. Ahmed Body and Chassis Engineering Ford Motor Co. 870056 Automotive Module Burn-in-A Means to Reliability Verif lcation 55 L Lee Kent Bendix Electronics Allied Automotive 870057 Calculating Semiconductor Cost of Ownership 61 Donald L. Denton Texas Instruments Dallas, TX
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Philip Koopman: koopman@cmu.edu